YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and …

YINCAE’s SMT 158D is a diamond filled liquid epoxy with a thermal conductivity of 6W/mK. The material is easy to dispense, minimizes induced stress and provides high-reliability performance. The epoxy is used for flip chips, chip scale packages, ball grid array devices and package and land grid array applications. The product is also suitable for bare chip protection such as memory cards, chip carriers, hybrid circuits and multi-chip modules. The epoxies are ideal for a…

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