DELO Presents Innovative Encapsulants for Packaging of Microelectronics

DELO presents convincing high-reliability DELOMONOPOX encapsulants for microelectronics. The role that high-reliability encapsulants play for appropriate packaging of microelectronic components subjected to aggressive surrounding conditions such as... (Industry News)

All Industry News  Subscribe to Ready-to-Use Adhesives & Sealants Newsletter

This glue news was spotted at Omnexus4Adhesives.com News in Adhesives and Sealants Solutions
Get the full story direct from source..