Electrically Conductive Adhesive supports RFID applications.

Designed to bond tiny chips to defined positions on RFID antenna, DELOMONOPOX AD268 adheres to variety of flexible and rigid substrates, including PET, polyimide, FR4, copper, aluminum, and silver. Anisotropic epoxy resin cures in 6 seconds at 190°C with thermode, enabling up to 20,000 microchips to be bonded per hour on flip-chip production system.

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