Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile

Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in shadowed out areas. “It is designed to cure in 10-30 seconds at 365nm with 10-40...

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