EV Group Launches EVG®850TB/DB Automated Temporary Bonding and Debonding System

EVG introduced the EVG®850TB/DB automated temporary bonding and debonding system built on the company's new XT Frame platform, which has been optimized to support thin-wafer processing for high-volume 3D IC and TSV manufacturing. (Industry News)

All Industry News  Subscribe to Ready-to-Use Adhesives & Sealants Newsletter

This glue news was spotted at Omnexus4Adhesives.com News in Adhesives and Sealants Solutions
Get the full story direct from source..