Flame Retardant Epoxy has single-component formulation.

Suited for semiconductors and transistors, EB-350-3LV exhibits stability at room temperature and accelerated curing at elevated temperatures. Single-component, low-viscosity epoxy encapsulant, with its flame out properties, will meet UL-94VO testing and has glass transition temperature of 140°C. Supplied in pint, quart, and gallons as well as 10 oz Semco cartridges, product withstands thermal shock when fully cured and offers continuous service up to 180°C.

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