In today’s electronic devices such as smartphones there are numerous complex engineering components. Expanding on its portfolio of advanced underfill materials, Henkel has developed Loctite UF3810, a new underfill technology that provides extremely high reliability while also enabling easier reworkability as compared to previous generation products. Ideally suited for today’s handheld communication and entertainment applications, Loctite UF3810 delivers excellent drop and shock protection.
This glue news was spotted at Henkel International - Press & Media Relations
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