High-Tg Underfill balances reliability and reworkability.

Suited for handheld communication and entertainment applications, LOCTITE UF3810 delivers drop and shock protection and thermal cycling reliability for fine-pitch (0.5 mm and below) area array devices. Material is halogen-free, completely reworkable, and has glass transition (Tg) temperature of 100°C, delivering thermal cycling reliability for next-generation wafer-level CSP (WLCSP) and PoP devices. Product underfills at room temperature and cures at 130°C.

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