IFTLE 95 3DIC – Time Flies When You're Having Fun; Further Details on the

EVG's ZoneBOND temporary bond / debond solutions and open materials platform include: the use of silicon, glass and other carriers; compatibility with existing, field-proven adhesive platforms; and the ability to debond at room temperature with ...
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ElectroIQ (blog)

This glue news was spotted at Google Alerts - Adhesive
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