Innovative Dismantling Adhesives Research

Rescoll Technological Centre's patented INDAR process is designed to debond structural adhesive joints on command, making disassembly of adhesive-bonded parts technically and economically feasible and changing the industrial outlook on structural... (Article)

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This glue news was spotted at SpecialChem4Adhesives.com Trends, Innovations and Solutions in Adhesives & Sealants
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