Mereco silver adhesive suits chip and leadframe bonding in heat-sensitive

April 4, 2012 - Marketwire -- Mereco Technologies' METADUCT 1202 is an electrically conductive silver epoxy adhesive for lead attachment cold soldering, chip bonding, and leadframe bonding applications. The product is solvent-free, meeting NASA ...
See all stories on this topic ยป

ElectroIQ

This glue news was spotted at Google Alerts - Adhesive
Get the full story direct from source..