The National Institute of Standards and Technology (NIST) recently announced it is soliciting proposals to support long-term research in next-generation semiconductor technology, which is critical to the future of the U.S. electronics industry.
Henkel Expands Range of Surface-mount Adhesives by Developing Loctite 3621
Henkel expanses its portfolio of surface-mount adhesives (SMA) with the company’s new product Loctite 3621. This adhesive has been validated for use with non-contact dispensing technologies, often referred to as jetting. This capability makes the SMA…..
K-Sun to Display Labeling Supplies for Wire Market at Nation’s Largest Wire Processing Event
K-Sun Corporation will be among more than 100 exhibitors at the Electrical Wire Processing Technology Expo held at Milwaukee’s Frontier Airlines Center May 9-10. K-Sun will showcase its label printers, label makers and labeling machines, including… (…
UPM Develops In-house Solution for Recycling Paper Based Release-liner
UPM has developed a new in-house solution for recycling paper based release liner back into pulp and paper. Release liner is the siliconised backing material that is an essential part of self-adhesive labelstock until the printed labels have been… (I…
OPX Biotechnologies Successfully Scales up its BioAcrylic Fermentation Process to 3,000 Liters
OPX Biotechnologies Inc. has announced another milestone that is a major step toward commercializing its more-economical and renewable alternative to petroleum-based acrylic acid. The company successfully demonstrated its fermentation process for… (I…
Cytec to Hike VANCRYL® Acrylic Resins Price in the Americas
Cytec Industries Inc. and its affiliated companies announced to its customers a selling price increase on its acrylate monomers, oligomers, and VANCRYL® acrylic resins sold in North America and Latin America. Effective with shipments made on or… …