Shin-Etsu Joins EVG’s Open Platform for Temporary Bonding/Debonding Materials

EVG has announced that Shin-Etsu Chemical Co., Ltd. has joined EVG's open platform for temporary bonding/debonding materials. Shin-Etsu's advanced adhesives will be qualified with EVG's EZR® (Edge Zone Release) and EZD® (Edge Zone Debond)... (Industry News)

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