Spot Curing Conductive Adhesive gels in 5 seconds at 200°C.

Featuring rubber-like flexibility, DB-1590 serves as solder replacement in crystalline silicon solar modules using thinned silicon and/or plated bus bars. Adhesive gels in 5 seconds or less, developing sufficient strength to withstand stresses induced by manufacturing process until adhesive cure is completed during encapsulant lamination process. Product has optimized rheology for dispensing, damp heat resistance, and conductivity stability on tin, tin-silver, and silver-plated ribbons.

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