Henkel signed an agreement to acquire Novamelt GmbH, a privately owned company based in the south of Germany. With this transaction Henkel as leading solution provider worldwide for adhesives, sealants and functional coatings will further enhance its c…
From 9th to 11th June, the specialist trade fair parts2clean in Stuttgart will once again become the international hub for product innovations and further developments in industrial cleaning technology. As a leading provider of complete systems in the …
Henkel AG & Co. KGaA’s Annual General Meeting saw all resolutions on its agenda passed by the voting shareholders. A total of around 1,500 shareholders attended the event, which was held in Düsseldorf on April 13, 2015.
23 student teams from 28 participating countries took part in the international final of the “Henkel Innovation Challenge” from April 8-10 in Vienna. During the three-day competition, the student competitors presented their innovative concepts for 2050. The jury of Henkel managers chose the Belgian team “The Sharp Shepards” as its winner. Jérémy Denisty, 23, and Marine Van Halle, 20, students at the Université Catholique de Louvain, won this year’s “Henkel Innovation Challenge.” The team’s “Persil Energy Patch” product was judged superior to the product proposals of their international competition at the final.
At Henkel’s Annual General Meeting today, CEO Kasper Rorsted reviewed the company’s successful performance in the fiscal year 2014. A dividend increase of 9 cents to 1 euro 31 cents per preferred share and 1 euro 29 cents per ordinary share was proposed to the shareholders. This represents a payout ratio of 30 percent. Despite market conditions that remain challenging, Rorsted confirmed the outlook for the full fiscal year 2015. This includes an increase in adjusted earnings per preferred share of approximately 10 percent.
At this year’s Ligna in Hannover from May 11 to 15, Henkel will be presenting its complete range of products for structural engineered wood components, known by the name of Purbond until now, under the Loctite brand for the first time. The focus of the product presentations will be on the new primers that have been specially developed for species-specific bonding of deciduous woods – a groundbreaking topic in timber construction. As adhesion promoters between the substrate surface and the adhesive, they assure the necessary strength of the adhesive joints in load-bearing construction elements made from deciduous woods.
The adhesives manufacturer Henkel is an expert in networking on all levels. One of the reasons behind the success of the worldwide leading solution provider is its practice of close networking with manufacturers in the furniture industry and their machine suppliers. Internally, the interlinking between the Henkel development departments spanning such diverse technologies as automotive engineering, electronics and medical technology through to furniture manufacturing, creates the ideal breeding ground for innovative adhesive developments. And finally, one of the company’s core competencies – bonding – is based on the chemistry of crosslinking.
Food packaging safety is an issue to which Henkel – as the leading solution provider for adhesives, sealants and functional coatings – is deeply committed. On its knowledge platform “Food Safe Packaging Portal,” Henkel will be holding a webinar on the topic “Ways to improve Food Safety” on April 24, 2015 at 09:00 AM CEST and additionally at 04:00 PM CEST. Mrs. Monika Tönnießen, responsible for Henkel’s European product safety and regulatory affairs within the Adhesive Technologies division, will give an overview about regulatory requirements and possibilities to enhance food safety.
On April 13, 2015 the Henkel Annual General Meeting took place in the CCD Congress Center in Düsseldorf / Germany.
The launch of Henkel’s much-anticipated game changing solder paste, Loctite GC 10, at the recent Apex even did not disappoint. Customers and booth visitors were intrigued and the industry took note. Loctite GC 10 is the market’s first-ever temperature stable solder paste, an innovation that earned the material an NPI Award in the highly competitive solder materials category.