Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life
Developed for potting, sealing, encapsulation and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure. This system features superior electrical insulation properties including a volume resistivity exceeding 1015 ohm-cm, a dielectric constant of 2.91 at 1 KHz and a dissipation factor of 0.009 at 1KHz. “EP110F8-5 is an easy to use, heat curing epoxy that is ideal for applications where dimensional stability, electrical insulation...This story is related to the following:Adhesives & Sealants
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