UV Cure Adhesive suits electronics assembly applications.
Non-conductive 535-10M-1 is flexible epoxy adhesive that suits disk drive, camera module, optoelectronic, and circuit assembly applications. Product is designed to eliminate any crowning (warpage) of sliders in head gimbal assemblies and can be used in other bonding applications in head stack assembly. Also, this antimony-free adhesive can be used for lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly.
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