Wire Bond Encapsulant acts as flexible circuit bonding adhesive.
Intended for printer head and circuit assembly applications, 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive imparts protection while reducing stresses associated with thermal cycling. Product exhibits chemical resistance to inks and adheres to flexible circuits, FR4, and metal substrates. Properties meet circuit assembly and semiconductor standards for ionic cleanliness (extractable ions) to prevent corrosion in high-temperature and -humidity environments.
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